Open VPX is the architecture framework that defines system level VPX interoperability for multi-vendor, multi-module, integrated system. HiK™ card frames increase thermal conductivity. Thermal design, simulation and analysis services. We offer a wide range of ATR chassis that are convection, conduction cooled and liquid cooled. Trident’s rugged small form factor (SFF) commercially off the shelf (COTS) embedded computer is designed for harsh environments of military, aerospace and heavy industries and addresses the challenging need for many space constrained applications in avionics, aerospace and defense industries. Rhino Forced Air – Conduction cooled ATR Chassis. All external interfaces are accessed through the P2 connector of the VME backplane. ATR Chassis. Small and extremely rugged, cold plate base coupled, conduction cooled enclosure measures 5″L x 6″W x 7. 5mm,) 3U and 6U backplane compatibility options, air or conduction cooling options and the ease of fast and simple backplane interchangeability for fluid transition between VITA and PICMG bus architectures, the Hartmann Open Frame Chassis solution is the tool. It can be installed in any standard conduction cooled VME chassis. For use in DC systems, they are 6 U high by 5 HP (1-inch) wide modules with guide blocks, for use in conduction cooled VPX systems. (COTS) and customized conduction cooled, ruggedized, small-form-factor, power supplies according to the VITA 62. 1) modules. Our Open Frame systems are available with air cooled or conduction cooled variants and 600W ATX power. μTCA. Liquid Cooling; Pumped Two-Phase; Liquid-Air HX; Tekgard® ECUs; Tekgard® Chillers; Embedded Computing Solutions. GS16 is a fully rugged, fully managed, standalone Gigabit Ethernet switch providing 16 10/100/…. Conduction Cooled VMEbus Modules. CP949. VME and VME64x VPX Power Backplanes Universalbus Test Adapters Components Power Supplies 19" Power. From conduction cooled to air cooled, from simple passive (power burning) resistor boards to active, monitored and controlled load boards, the customer has a variety of load board solutions to choose from. The Nova Integration Solutions 3000 Series consists of a family of custom and standard ATR reference designs and enclosures also referred to as a chassis, in support highly rugged and MIL spec. Commercial off-the-shelf (COTS) and customized conduction cooled, ruggedized, small-form-factor, power supplies according to the VITA 62. W-IE-NE-R offers a VME / VME64 chassis line in a compact design as VME mini crates or in full size with 21 slots for 19″ rack mounting with for both 6U and 9U VME bus cards. Additional backplanes are available, including VME,. Development chassis and accessories for VPX and SOSA aligned module payloads to support every stage of product development. 0 specification for use in Mil/Aero VPX systems. With features ranging from integrated FPGAs to SecureCOTS™ technology for protecting data from observation or modification to. <br /> If you’ve ever dreamed about controlling<br /> your VME system directly from your desk-<br /> top system, your dream. Boards are inserted in the back of the chassis in a vertical orientation. Related To: Dawn. The top-loaded enclosure accepts 6U double-Eurocard-format conduction-cooled modules constructed to meet the IEEE1101. ICE-Lok® VME/ VPX Card Frames; Conduction Cooled Chassis; Liquid Cooled Chassis; Enclosure Cooling Products. (Figure 1 and Figure 2. 0 in. Tested to MIL-STD-810, VITA47. Add to Cart. 2). The DK3 / DK6 for 3U and 6U VPX system design, support air and conduction cooled modules with quick conversion that tracks and streamlines your development cycle. Verifies chassis can meet power requirement and specifications for VPX. Part Number: 11-1011777-2119. The chassis can accept a front and a Rear Transition Module (RTM). 08 of Vita65. 6U VPX air cooled as per VITA 62, front Panel with Extractor handle, 160 mm deep. Air-Cooled variants are designed to be used in standard industrial VME chassis. CCG-6860 conduction-cooled card guide introduced by Dawn VME Conduction cooled card guide for Dawn DC-(n) Series air cooled development chassis. The XPand1011 system is a low-cost development platform for conduction-cooled 6U VPX cards. Products facilitate plugging of conduction-cooled modules into a backplane for testing and development. Status LED indicators allow users to verify proper Operating Temperature: -4 to 122 F; Type: Rack. This system is downward-compatible, so that assemblies with VME 96-pin connectors can still be used, while adopting the use of serial signals such as Gigabit Ethernet, PCI Express, Serial RapidI/O, and other. Trident’s rugged small form factor (SFF) commercially off the shelf (COTS) embedded computer is designed for harsh environments of military, aerospace and heavy industries and addresses the challenging need for many space constrained applications in avionics, aerospace and defense industries. Curtiss-Wright Controls Embedded Computing announced the availability of conduction-cooled rugged versions of the company's popular CHAMP-FX digital signal processor (DSP) 6U VME64x and VITA-41 engines, making this dual-FPGA board ideal for demanding signal processing applications that require survivability in harsh environments. 1, and VITA 48 (both 0. Offered as part of firm’s Test/Development chassis for OpenVPX, CompactPCI and VME/VME64x systems, products fit in IEEE 1101. VME and VME64x Systems. W-IE-NE-R offers a VME / VME64 chassis line in a compact design as VME mini crates or in full size with 21 slots for 19″ rack mounting with for both 6U and 9U VME bus cards. Compatible to both air cooled and conduction cooled. Why We Are the Leaders in COTS FPGA-Based High Performance Computing. Form Factor: 6U VME Processor: NXP QorIQ T2080 Memory: 8 GB DDR3 Ethernet: 8 10/100/1000BASE-T USB: 1 USB 2. Up to 128 Gbytes DDR4 memory for server grade applications. Small and extremely rugged, cold plate base coupled, conduction cooled enclosure measures 9″L x 6″W x 7. Available in 3U or 6U form factors, the conduction-cooled chassis support a wide range of architectures, including VPX, VME, VME64x, VXS, and CompactPCI. A&A Performance Chassis : 3352 Compton Rd. The PSC-6236 features a mission critical wide temperature range at high power on a 1 inch pitch. Compared to conventional wedge locks, the ICE-Lok creates additional heat transfer paths from card to chassis, thereby reducing the thermal resistance. , the wedgelock supply is located such that they are also cooled through the bulkhead) Mechanical Meets ARINC 404A ATR System Mechanical Design Overall Chassis Dimensions: 10. Elma's new liquid cooled chassis is available with a 6U OpenVPX backplane on a 1″ pitch per VITA 65 Backplane Profile BKP6-CEN07-11. Downloads. Subrack based, sheet metal, desktop or tower configurations. 1 6U part # description VME-HF-3U 3U VME Heat Frame Blank Assembly Kit VME-HF-6U 6U VME Heat Frame Blank Assembly Kit CPCI-HF-3U 3U. 2) modules. Power and reset LEDs are provided for. pitch, high-bandwidth backplane, and 400 W power supply. CPCI Chassis. Our newest system, ideally suited for Test and Measurement applications with high data transfer and synchronization requirements. 0 specification for use in. Kontron's standard selection of 3U and 6U CompactPCI card cages and ready integrated system platforms. The P0CC1 6U PMC Carrier is a single slot replacement unit supporting two single or one double width PMC which can beForm Factor: 6U VPX Chassis Type: Development Number of Slots: 2 Dimensions: 17. Load boards convection or conduction cooled • Rear Transition Modules for I/O • Intel & Freescale Single Board Computers • Blade level networking boards (Ethernet, PCI Express) • Rackmount, desktop, and ATR chassis platforms • Ruggedization programs 6U 7-Slot OpenVPX Backplane BKP6-HYB07-11. 62. These 3U VPX boards are delivered with full artifact packages to reduce the risk, cost, and development time required to reach certification. SOSA Products. 0 specification for use in. From. 3) CompactPCI Serial is an industrial standard for modular computer systems. CP931. W-IE-NE-R offers a VME / VME64 chassis line in a compact design as VME mini crates or in full size with 21 slots for 19″ rack mounting with for both 6U and 9U VME bus cards. Aitech Defense Systems Inc. Relative Humidity: 90. Related To: Dawn VME Products 6U VME64x 195-x Mini Chassis. (Table 3) The PCI sub-system can support from 2 to 9 PMCs within a standard VME chassis (see P0CC1 datasheet for more detail). Utilizing our extensive experience in embedded. HSC (Heat Sink Coolers) HPC (Heat Pipe Coolers) TEC (Thermoeletric Coolers) VCC (Vapor Compression. The planar heat pipes are also called vapor chambers which are used as. W-IE-NE-R offers a VME / VME64 chassis line in a compact design as VME mini crates or in full size with 21 slots for 19″ rack mounting with for both 6U and 9U VME bus cards. This thin VME chassis comes with a 250W cPCI hot-swap power supply and horizontally oriented card slots. 0 specification. Its short and efficient thermal conductivity path provides for robust cooling performance and maximum power dissipation. 19” chassis are a form of subrack which has been specially designed to accept horizontally oriented boards or non-standard components, such as transformers or other heavy accessories, typically mounted on a chassis plate. 0 specification for use in Mil/Aero VPX systems. International Journal of Science and Research (IJSR) ISSN: 2319-7064 SJIF (2022): 7. 2) modules. The design incorporates a Blu-Ray drive, SBC, Power Supply and ECS (Environmental Control System). CompactPCI Serial Chassis. card assemblies in a format suitable for military and rugged applications and to ensure their compatibility with both conduction cooled chassis and commercial, air-cooled, single height (3U) and. Works With: Conduction Cooled Enclosures Clamp Force: 300 – 399 lbf / 136 – 181 kg Gap Width: PCB + (0. Environment: Extended Temperature, Extended shock & vibration : Height: 10. {VME Rugged Chassis manufacturer} MCH Systems {Rugged retma rackmount and ATR VME chassis}Designed by Dawn’s engineers to specifically support OpenVPX and VPX REDI 3U boards and modules. 87"W x 3. Different widths and combinations of 3 and 6U slots are available also. PICMG 2. Our VME Chassis are made for industrial applications in vertical and horizontal orientation of the backplane and cards. 8 in. For all rugged environments: Air, Land, and Sea. Chassis: 1 ATR, 6U 11-slot, VME/VPX-based conduction-cooled solution. An open-frame solution for the open-minded engineer. VITA 62 power connector. . Conduction cooled base coupled, via short and efficient path, provides for optimum cooling. VME and VME64x VPX Systems Hardware Platform Management Components - AdvancedTCA. A user's guide to the VME, VME64 and VME64x bus specifications - features over 70 product photos and over 160 circuit diagrams, tables and graphs. A network-attached Flyable Data Loader (FDL). 0 specification for use in Mil/Aero VPX systems. The DK3 / DK6 for 3U and 6U VPX system design, support air and conduction cooled modules with quick conversion that tracks and streamlines your development cycle. It supports up to two 0. PXI /. From conduction cooled to air cooled, from simple passive (power burning) resistor boards to active, monitored and controlled load boards, the customer has a variety of load board solutions to choose from. VPX combines best-in-class technologies to assure a very long technology cycle. Watch our Conduction Cooled Assembly (CCA) design process - we'll walk through the process from start to finish including: Comprehensive consultation from the very beginning. Revolutionary design allows for up to 175 Watts per slot of conduction cooling; Precision machined from 6061 T6 Aluminum; Corrosion resistant gold alodine finish; Field installable using 4-Torx driven screws; Fits all Dawn DC-n series development chassis; Installs in place of plastic guides; Converts air cooled chassis to conduction cooled Learn more about Hartmann Electronic's card guide with a conduction cooled cold plate 50HP for Open Frame Chassis, 5HP slot pitch. Performs an amazing range of applications, and tests such as OpenVPX Rule Compliance testing and certification, system design validation and characterization. Built with aluminum the chassis are suitable for rugged airborne applications and can operate in under extreme temperatures, dust and humidity. Convection, conduction and liquid cooled ATR enclosures support a wide-range of applications for Land, Air and Sea. Conduction cooled base coupled, via short and effi cient thermal path, provides for optimum cooling. As well as removing the heat from PCBs where convection alone is insufficient, the CCA devices also provide mechanical support for the. The chassis comes with different sizes and. Conduction Cooled Assemblies consist of a conduction-cooled frame, backing plate or backing strips, extractors and wedge clamps. Abstract: A means to utilize conduction-cooled VME electronics modules in an air cooled system is provided. ICE-Lok® VME/ VPX Card Frames; Conduction Cooled Chassis; Liquid Cooled Chassis; Enclosure Cooling Products. Doubles as an important monitoring, data logging, and reporting device when included within deployed. Application. (ACT) is a premier thermal management solutions company, focusing on custom applications of two-phase heat transfer technology. pdfA VME Chassis will be between 1 and 21 slots (the maximum). Development chassis for VPX and SOSA aligned module payloads. The chassis interface 400 comprises convection bridge heat exchanger 402, standard 6U VME electronics module 404, a heat flow 406, an air flow 408, a card slot pitch height 410, generic 6U VME backplane 420, generic 6U VME connectors 412, a modified chassis side panel 414, a wedgelock clamp 416, and non-conduction-cooled standard 6U VME modules. Utilizing our extensive experience in embedded. Standard selection of 3U and 6U CompactPCI card cages and ready integrated system platforms. Liquid Cooled 1 ATR Chassis, Tall, Short Air Transport, Rugged, for 6U VPX Boards † 1 ATR platform with liquid cooled side walls, 6U conduction cooled boards, 1” pitch, per VITA 48. Level 4-5 Conduction Cooled 1; Levels 1 through 3 and 5 – Air, Conduction Cooled 1;. Subrack based, sheet metal, desktop or tower configurations. 8” and 1. The most rugged packaging for computing. 6U CompactPCI. (COTS) and customized conduction cooled, ruggedized, small-form-factor, power supplies according to the VITA 62. Hartmann Electronic is an industry leader in the designing, manufacturing and production of backplane technology, including VME and VME64x. Versions in alignment with the SOSA (TM) Technical Standard. Liquid Cooling; Pumped Two-Phase; Liquid-Air HX; Tekgard® ECUs; Tekgard® Chillers; Embedded Computing Solutions. System. 8 in. VITA 46. (COTS) and customized conduction cooled, ruggedized, small-form-factor, power supplies according to the VITA 62. VPX systems are typically built with an air or conduction cooled chassis which holds the VPX backplane and provides the mechanical support for the VPX plug-in modules. The mechanical design of VITA 48. Our VME Chassis are made for industrial applications in vertical and horizontal orientation of the backplane and cards. 8-inch pitch backplanes. 10/. Full environmental sealing insures reliable operation in any environment. 3U VPX, 1/2 ATR, Conduction Cooled. PSU, open frame, 444 W (400 W at < 180 VAC) Backplane VME 8 slot, 6 U, J1/J2 monolithic in accordance with VITA 1-1994. This short 1/2 ATR ships with a 6-slot OpenVPX™ backplane and can accommodate other architectures such as 3U CompactPCI® and MicroTCA™. Different widths and combinations of 3 and 6U slots are available also. 0 in. This platform supports up to eight 0. 0 specification. 10/. It features optional 6x100G optical transceivers to VITA 66 backplane and optional front panel RS422/RS485 GPIO interface. View Orion's Single Board Computers here. By leveraging low cost silicon and software developed for PCI, CompactPCI has become the world’s most popular modular open computer. ACT developed an integrated design and delivered turnkey parts that were developed to be highly ruggedize and provided thermal conductivity > 750 W/m-K. ATR, rugged, air- and conduction-cooled, Integrated Systems} kontron {VME Rugged-Standard-3 to 18 slot} MacroLink Inc. The backplane provides seven slots, each cooled up to 100 W; one slot for storage, one for switch and five payload slots. Airstack ® air-cooled modules are available in a wide range of capacities and with tandem scroll compressor sets to create chillers with a 10 to 600 ton. 0 in. It is conduction-cooled through the card edge/wedgelock. The two-phase cooling process works by using the latent heat of a working fluid to efficiently transfer the heat from the source to a remote heat sink. heat to the chassis walls and finally to a cold plate. Two test point outputs and microcontroller- based. Performance “Eye”-tested and Dawn patented Fabric Mapping Modules allow customization of. Our Open Frame systems are available with air cooled or conduction cooled variants and 600W ATX power. It supports up to two 0. PSC-6234 3U 400-Watt 6-channel plug-in or bulkhead mounted Power Supply for conduction cooled OpenVPX systems. The Hybricon portable tower conduction-cooled enclosures are high performance development chassis with cooling for up to 150W per slot. VPX is a broadly defined technology utilizing the latest in a variety of switch fabric technologies in 3U and 6U format blades. 1 PICMG 2. This portable chassis is well built, attractive and travels well between the bench top, the trade show, and your customers. 1 PICMG 2. Watch our Conduction Cooled Assembly (CCA) design process - we'll walk through the process from start to finish including: Comprehensive consultation from the very beginning. The card slots within a chassis hold the heat frames that PCB boards attach to. VME-6U-COOL has 12 positions for fans to be mounted. Up to 20 CFM of airflow is provided per slot. Airborne, shipborne and ground deployment; 3U/6U High ATR Chassis with upto 14 Slots Card Area; 3U/6U(VPX / cPCI/ VME) Backplane Options; 1ϕ / 3ϕ AC or 28v DC Input power supply (up to 1500w) Input Transients as per MIL-STD-704E / MIL-STD-1275D;Product Features. 3V/25A, 5V/20A, 12V_AUX/1. 3U 2 Slot OpenVPX Development Chassis. All conductive plates and surfaces are typically aluminum. Input Voltages: 85-264 VAC, 5. Get more information on our VME Processors, such as the 6U VME7555 and VME7653 from Orion Technologies on. 8-inch pitch backplanes. The stronger the need for computer power, the more. 2 coaxial/RF for four of the slots (defaultbackplane routing) All I/O are thru the front of the chassis; 250W integrated. 2, VITA 30. (COTS), air or conduction cooled single stage converters according to the ANSI/VITA 62. Aluminum card guides can be assembled in place of polycarbonate with optional conduction cooled card guides, if needed. The XPand1004 system is a low-cost development platform for conduction-cooled 3U VPX cards. 300-400 Watts Pluggable VPX PSU. Supports air cooled and optionally conduction cooled boards. 9 mm) Design Feature: Tolerance Compensating. Input range is 85-264 VAC, 47-400 Hz. CP949 is a 7-port Ethernet switch in a conduction cooled, single-slot 6U CPCI form factor. Heat dissipation by 1 fans (fan tray), cooling bottom. 3) CompactPCI Serial is an industrial standard for modular computer systems. 8 GHz : 2x PMC/XMC : Rugged Air Cooled and Conduction Cooled : Available in multiple ruggedization levels : SBC314C Flight-Certifiable Single Board ComputerVPX is a broadly defined technology utilizing the latest in a variety of switch fabric technologies in 3U and 6U format blades. This portable chassis is well built, attractive and travels well between the bench top, the trade show, and your customers. Dawn’s DEV-4117 Multi-Platform Table-Top Development Chassis for 6U boards coupled with Dawn’s Hybrid VME64x/VPX backplane provides a natural migratory development environment and path for upgrading systems to the latest VPX technology. The 64PS1 is a 600 Watt DC/DC Converter that plugs into a 6U VME chassis with an 0. 6U VPX & VME Systems. 3U/6U Short/Short, Short/Long, Tall/Short, Tall/Long & Dwarf to 1 ½ ATR Chassis. • (3) Ethernet Ports. Maximum power dissipation depends on cold plate. PSC-6265. This helps multi-sourcing, and means that a range of chassis architectures is available to suit different deployed scales and architectures. nVent SCHROFF offers two 19" chassis platforms, MultipacPRO and Interscale, both with options for various. 2 specification. 600-Watt DC/DC Converter, 6U VME. 6U CompactPCI. This platform conforms to VITA 1. 2-7. We take pride in being able to fulfill the majority of our customers’ needs through custom development. 0 in. Performance “Eye”-tested and Dawn patented Fabric Mapping Modules allow customization of. High-Performance Cooling with 8 fans in Push/Pull. PSC-6238 3U VITA 62 / 800W 28VDC Input Conduction Cooled PSC-6265 6U VITA 62 / 580W Universal AC Input Conduction Cooled PSC-8724 3U / VITA 62 Low Power High Efficiency with Integrated Hold-upAn open-frame solution for the open-minded engineer. Enclosures that accommodate up to twelve 3U and 6U VME, CompactPCI and VPX conduction-cooled boards. 3U / VITA 62 / 400W. The crate offers 9 VME64x slots in a compact designed chassis with integrated low noise power supply and cooling fan. Our VME Chassis are made for industrial applications in vertical and horizontal orientation of the backplane and cards. 1. Airborne, shipborne and ground deployment. Advanced airflow design distributes air across external fins in sidewalls. 2 standard for conduction cooled VME systems. Our Open Frame systems are available with air cooled or conduction cooled variants and 600W ATX power. 8 in. Our VME Chassis are made for industrial applications in vertical and horizontal orientation of the backplane and cards. Such means comprises a modified convection-cooled VME compatible chassis that includes a convection bridge thermally interfaced with a VME electronics module just as a conduction chassis would. This platform conforms to VITA 1. a VME chassis. It is based on the established PICMG 2. Conduction-cooled PMCs, PPC4A offers expansion with a family of standard PMC Carrier Cards. The aim is to. The patented Isothermal Card Edge ICE-Lok ® is designed to enhance thermal performance for conduction-cooled embedded computing systems. Systems Integration Plus, Inc. Conduction Cooled. Liquid Cooling; Pumped Two-Phase; Liquid-Air HX; Tekgard® ECUs; Tekgard® Chillers; Embedded Computing Solutions. The total height of the 6023 bin is either 9U (6U VME/VXI/PCI) or 12U (9U VME/VXI). Radstone or third-party ATR style enclosures. C: 70 Input 28VDC: 1. W-IE-NE-R offers a VME / VME64 chassis line in a compact design as VME mini crates or in full size with 21 slots for 19″ rack mounting with for both 6U and 9U VME bus cards. OpenVPX 6U 8-slot ATR Chassis; OpenVPX 6U 10-slot Air Over Conduction 1200 Watts / Drive Bay; ATR-3500 6-slot MicroTCA with cPCI and VPX Backplane options; ATR-5700 6-slot 3U VPX Air Cooled; RGE-9313; RGE-9613; RGE-9813; RGE-9853;Dawn VME 11-1015501 7-Slot VMEbus Chassis. High Quality Chassis and Enclosures for VME and VME64x Applications. It can withstand extreme environmental conditions such as temperature, shock, vibration. This switching power supply accepts a +28 VDC input and provides a single output at 600 Watts continuous or 1,000 Watts peak. This switching power supply accepts a +28 VDC input and provides a single output at 600 Watts continuous or 1,000 Watts peak. This helps multi-sourcing, and means that a range of chassis architectures is available to suit different deployed scales and architectures. 66A ON. manufactures and sells Power Supplies for various COTS architecture systems to include custom and standard designs. Description. Elma offers both standard and custom subracks for a wide variety of bus standards including VME, VME64x and VXI systems. The VT874 is designed for the rugged extremes of avionics, naval, and ground vehicles applications. 0 - 7. Conduction cooling methods move heat from the source to a cooler area over a short distance; the heat can then be removed by liquid- or forced-air cooling. The 6023 bin for 6U or 9U cards bin in addition to the 2U high fan tray space a 1U air compression chamber below the front card cage. It is conduction-cooled through the card edge/wedgelock. 3V. Sizes from 1/2 ATR to 3/4 ATR are available with various backplane architectures. 3U VPX VITA 67 Development Platform for Conduction-Cooled RF Modules and Intel® Core™ i7 Processor-Based Module. CAD templates and 3D printed prototypes available. Our VME Chassis are made for industrial applications in vertical and horizontal orientation of the backplane and cards. 4 RS-232/422/485 Chassis Type: Sub-½ ATR Number of Slots: 2 Dimensions: 11. A means to utilize conduction-cooled VME electronics modules in an air cooled system is provided. manufactures a variety of rugged modular conduction cooled chassis as well as 19” and 19” 1/2 form factor enclosures and a full range of 3U and 6U COTS modules for VPX , VITA 73 and CPCI applications. 3U 11 Slot OpenVPX Devlopment System. The 64PS1 is a 600 Watt DC/DC Converter that plugs into a 6U VME chassis with an 0. Air cooled, conduction cooled and liquid cooled options. +70°C, ≤ 8 slots: -40°C. The ANSI VITA 62 standard defines the mechanical and electrical specifications for commercial-off the shelf plug-in power supply modules in 3U and 6U format. Aids in locating hot spots in the chassis. Includes one solid state Disc Drive Carrier mounted on the side behind front I/O panel. Output Voltages: 12V/50A, 3. HSC (Heat Sink Coolers) HPC (Heat Pipe Coolers) TEC (Thermoeletric Coolers) VCC (Vapor Compression. face of the chassis, the area most likely to be damaged if the unit is accidentally dropped. Power Supplies are available in 3U and 6U, in air- and conduction- cooled form factors >for cPCI, VPX, VME64x & custom applications. SOSA-Aligned 100GbE EcoSystem. LONDON--(BUSINESS WIRE)-- nVent Electric plc (NYSE:NVT) (“nVent”), a global leader in electrical connection and protection solutions, today launched a new High Thermal Integrated Conduction Cooled Assembly for the aerospace and defense industries. Extended Description. RuSH enhanced 3u conduction cooled power supply Wedge-lock style card guides to support conduction cooled boards available as an option. The XPand1202 provides a low-cost, flexible, VITA 67 development platform. The liquid-cooled chassis sidewalls will support electronic modules each dissipating in excess of 150 watts. Operating Temperature > 8 slots: 0°C. Liquid Cooled ATR Enclosure. 0 specification for use in. 3U Conduction Cooled VPX Extender. 8" &' 1. Meets ARINC 404A and. HSC (Heat Sink Coolers) HPC (Heat Pipe Coolers) TEC (Thermoeletric Coolers) VCC (Vapor. Find 6U VME Chassis related suppliers, manufacturers, products and specifications on GlobalSpec - a trusted source of 6U VME Chassis information. VPX breaks out from the traditional connector scheme of VMEbus to merge the latest in connector and packaging technology with the latest in bus and serial fabric technology. Advanced Cooling Technologies, Inc. 8 in. W-IE-NE-R is providing a line of conduction cooled VITA 62 compliant modular plug-in power supplies for VPX applications. 600-Watt DC/DC Converter, 6U VME. 11 modular extrusions. Commercial off-the-shelf (COTS) and customized conduction cooled, ruggedized, small-form-factor, power supplies according to the VITA 62. Single/dual cooled side walls. The XPand6200 Series is a true Commercial-Off-The-Shelf (COTS) rugged system, supporting many 3U VPX, XMC, and PMC modules without modifications to the chassis or backplane to accommodate I/O. Hartmann Electronic’s 4 slot 19” rack mountable VME solution – The VME64x 2U system. We offer air & conduction cooled power supply units for wide range AC as well as DC input. The power supply options range from a 400W ATX for low end applications to a 1200W modular supply for high end power requirements. Front mounted power switch. Edge board with MIL-DTL-38999 circular connectors. 1 switch and 10G backplane Ethernet switch in a single 3U module, enabling you to connect between a wide range of module types – including those with earlier Gen 1 or Gen 2 PCIe interfaces. We offer various air cooled (front-to-rear, side-to-side, bottom-to-top, etc) configurations and conduction-cooled options. 6"W x 9. The XPand1200 is a low-cost, flexible development platform, supporting up to eight 0. 3 V. WILDSTAR 3XV7 3U OpenVPX FPGA Processor – WB3XV7. 8” slot. 2. Conduction cooled ATR Chassis; Development Chassis; IEEE 1101. The study focuses on the cooling limitations of a 6U VME by conduction. All prices are shown in USD. The VME195-x mini crate is the perfect choice for small setups with only a few VME64x modules. Conduction cooling moves the heat from the printed board through a heat transfer surface to the chassis walls and structure where the air circulating nearby removes the heat. 8 (. VME 11; PCI Express 10; cPCI 3U 9; 3U VPX 8; Software 6; Thunderbolt 3 6; VXI 6; 3U 5; cPCI 6U 5; PCI 4; ISA 3; Mini PCI Express 3;. Hartmann Electronic is an industry leader in the designing, manufacturing and production of backplane technology, including VME and VME64x. Different slot counts dependant on slot pitch (0. ACT manufactures copper/water heat pipes into two basic geometries: Tubular Heat Pipes and Planar Heat Pipes. 0 specifications. Our newest system, ideally suited for Test and Measurement applications with high data transfer and synchronization requirements. ICE-Lok® VME/ VPX Card Frames; Conduction Cooled Chassis; Liquid Cooled Chassis; Enclosure Cooling Products. Wedge lock conduction cooled module. W-IE-NE-R offers a VME / VME64 chassis line in a compact design as VME mini crates or in full size with 21 slots for 19″ rack mounting with for both 6U and 9U VME bus cards. pdf; 103-7663-001_D. January 25, 2021. Performance “Eye”-tested and Dawn patented Fabric Mapping Modules allow. Learn more about Hartmann Electronic's card guide with a conduction cooled cold plate 50HP for Open Frame Chassis, 5HP slot pitch. 3U/6U (VPX / cPCI/ VME) Backplane Options. 0 CompactPCI standard, which uses the parallel PCI bus for communication among a. 5-Slots of 3U VPX on 1″ pitch (OpenVPX Ready) Integrated intelligent Power Supply provides up to 400 Watts of 6-channel power. While conduction cooling dominated rugged embedded computing systems just a few years ago, the trend today is shifting to approaches that blend-in air cooling like VITA 48. 10/11; Backplane conforms to VITA 1. Systems Integration Plus, Inc. 64PS1 - North Atlantic Industries.